Researcher Database | Faculty of Engineering Department of Mechanical Engineering | Katsumi Miyama |

（Last updated : 2024-12-02 09:28:58）

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Katsumi Miyama

Department / Course Hokkaido University of Science Faculty of Engineering Department of Mechanical Engineering

Job Professor

Academic background
2013/03 Degree Acquisition

Present specialized field
Others, Others

Book and thesis
Books	Board design of device embedded substrate for miniaturization and high performance of electronic devices (Co-authored) 2021/12
Papers	Manufacturing Process of Printed Circuit Board and Technology Trends Journal of The Surface Finishing Society of Japan,pp.472-477 (Sole-authored) 2024/11/01
Papers	Development of the file performance tester based on the shaper Journal of the Japan Society for Abrasive Technology,pp.143-149 (Co-authored) 2023/03/01
Papers	Circulation plating method for the piping manufactured by metal-powder bed fusion Chemical Industry,pp.95-103 (Co-authored) 2022/02
Papers	Joining Interface of Plating and Solder Journal of The Surface Finishing Society of Japan,pp.530-536 (Co-authored) 2021/07
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Academic conference presentation
2019/11	Fabrication of Fine Pattern with Imprint Technique (ISMP-EMAP 2019)
2018/10	Effect of substrate construction on deformation and stress distribution of the device-embedded substrates (IMPACT 2018 Conference)
2018/07	The Sixth Japan-US NDT Symposium on Emerging NDE Capabilities for a Safer World (The 6th JAPAN-US NDT Symposium)
2017/04	Effects of External Bending Stress on Device-Embedded Substrate (2017 International Conference on Electronics Packaging)
2015/10	The application of thermographic measurement to defect detection beneath a nano-micro scale surface finishing film (JSNDI Fall Conference Intrenational Session)
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