Researchers & Faculty
Japanese
Shigeru Saito
Department / Course
Hokkaido University of Science Faculty of Engineering Department of Mechanical Engineering
Job
Professor
Academic conference presentation
2015/04
Effects of Internal Stress of Electroless Ni Plating on Solder Joining Strength (2015 International Conference on Electronics Packaging and iMAPS All Asia Conference)
2014/06
Structural Stability of Diffusion Barrier Coating at High Temperatures based on Experimental Phase Diagrams (International Symposium on High-temperature Oxidation and Corrosion(ISHOC) 2014, Abstracts)
2013/10
Phase Equilibria and Tie-line Compositions of the σ and (γ，γ’，β) Phases in the Ni-Al-Re-Cr System at 1150℃ (Proceedings of Materials Science & Technology(MS&T) 2013 Conference)
2008/10
Tie-lined Compositions of theσand(γ,γ',β)phases in a Ni-Al-Re-Cr system at 1423K (PRiME (PACIFIC RIM MEETING) 2008)
2006/02
Evaluation of Bonding Strength and Interface Used on AlN/Cu Brazing and Cu/Cu Solder-joints (12th Symposium on "Microjoining and Assembly Technology in Electronics")
2006/02
Growth of Reaction Layer in Sn-Ag Based Solder/Cu-plate Interface (12th Symposium on Microjoining and Assembly Technology in Electronics，)
2005/03
Re-Cr-Ni系合金の平衡状態 (2005 Symposium on Materials and Systems for Energy Conversion)
2005/02
Growth of Reaction Layer in Sn-Ag Based Solder/Cu-plate Interface (11th Symposium on Microjoining and Assembly Technology in Electronics)
2005/02
Research on Dissolution of Electrode Material with Lead-Free Solders and Structure of Reaction (11th Symposium on Microjoining and Assembly Technology in Electronics)
2003/02
Dissoution of Copper-plate and Growth of Reaction Layer with Lead-Free Solders (9th Symposium on "Microjoining and Assembly Technology in Electronics")