Researchers & Faculty
Japanese
Katsumi Miyama
Department / Course
Hokkaido University of Science Faculty of Engineering Department of Mechanical Engineering
Job
Professor
Book and thesis
Books
Board design of device embedded substrate for miniaturization and high performance of electronic devices (Co-authored) 2021/12
Papers
Development of a Degradation Diagnosis Technology to Improve the Safety of Ankle-Foot Orthoses BUNSEKI KAGAKU,pp.331-344 (Co-authored) 2026/06/05
Papers
Manufacturing Process of Printed Circuit Board and Technology Trends Journal of The Surface Finishing Society of Japan,pp.472-477 (Sole-authored) 2024/11/01
Papers
Development of the file performance tester based on the shaper Journal of the Japan Society for Abrasive Technology,pp.143-149 (Co-authored) 2023/03/01
Papers
Circulation plating method for the piping manufactured by metal-powder bed fusion Chemical Industry,pp.95-103 (Co-authored) 2022/02
Papers
Joining Interface of Plating and Solder Journal of The Surface Finishing Society of Japan,pp.530-536 (Co-authored) 2021/07
Papers
Effects of External Bending Stress on Characteristic Change of Embedded Device Transactions of The Japan Institute of Electronics Packaging Vol.10 (No.1),pp.1-6 (Co-authored) 2017/12
Papers
Effects of Internal Stress of Electroless Nickel Plating on Solder Joining Strength Transactions of The Japan Institute of Electronics Packaging Vol.8 (No.1),pp.1-7 (Co-authored) 2015/12
Papers
FormationofInter-DiffusionLayerbetweenNiCrAlYCoatingandNbSubstrateduringVacuumHeat-Treatment Materials Transactions (Co-authored) 2015/03
Papers
Experimental Determination of the Isothermal Section in a Ternary Re-Cr-Nb System at 1500℃ Materials Transactions, Vol.55 (No.2),pp.298-303 (Co-authored) 2014/02
Papers
Tie-Line Compositions of the γ and δ Phases in the Binary Re-Ni System Materials Transactions Vol.53 (No.6),pp.1078-1083 (Co-authored) 2012/06
Papers
Tie-Line Compositions of the σ and (γ, σ) Phases in the Re-Cr-Ni System at 1573K The Japan Institute of Metals, (2011) Vol.52 (No.12),pp.2174-2177 (Co-authored) 2011/12
Papers
Influence of heating rates on ceramic-metal joining strength Advanced Materials '93, III / Trans.Mat. Res. Soc. Jpn. (1993) Volume 16B,pp.1105-1108 (Co-authored) 1993
Other
NewICTTrendsBankonDevice-EmbeddedPCBs Asia Electronics Industry, October 2015 (Sole-authored) 2015/10