Researcher Database | Faculty of Engineering Department of Mechanical Engineering

Katsumi Miyama

Department / Course Hokkaido University of Science Faculty of Engineering Department of Mechanical Engineering

Job Professor

Academic conference presentation
2019/11	Fabrication of Fine Pattern with Imprint Technique (ISMP-EMAP 2019)
2018/10	Effect of substrate construction on deformation and stress distribution of the device-embedded substrates (IMPACT 2018 Conference)
2018/07	The Sixth Japan-US NDT Symposium on Emerging NDE Capabilities for a Safer World (The 6th JAPAN-US NDT Symposium)
2017/04	Effects of External Bending Stress on Device-Embedded Substrate (2017 International Conference on Electronics Packaging)
2015/10	The application of thermographic measurement to defect detection beneath a nano-micro scale surface finishing film (JSNDI Fall Conference Intrenational Session)
2015/04	Effects of internal stress of electroless Ni plating on solder joining strength (2015 International Conference on Electronics Packaging and iMAPS All Asia Conference)
2014/11	Development of bare die embedding substrates (Forum be-flexible 2014 Thin Semiconductor Devices on Nov 19, 15th International Workshop)
2014/11	Fabrication of fine pattern with imprint technique (Forum be-flexible Flexible 2014 Electronics Systems on Nov 20, 13th International Workshop)
2014/06	Structural Stability of Diffusion Barrier Coating at High Temperatures based on Experimental Phase Diagrams (International Symposium on High-temperature Oxidation and Corrosion(ISHOC) 2014, Abstracts)
2013/11	Tie-line Compositions of the σ and (γ，γ’，β) Phases in the Ni-Al-Re-Cr System at 1150℃ (Proceedings of Materials Science & Technology 2013)
2013/10	Phase Equilibria and Tie-line Compositions of the σ and (γ，γ’，β) Phases in the Ni-Al-Re-Cr System at 1150℃ (Proceedings of Materials Science & Technology(MS&T) 2013 Conference)
2013/01	Embedded Device Substrate and Inner Mount Technologies (19th Symposium on "Microjoining and Assembly Technology in Elwctronics"　2013　(ISBN 9784-906110-22-3 C3054))
2003/02	Development of Micro Solid bump Technology for High Density Interconnection and Thermal Management (9th Symposium on "Microjoining and Assembly Technology in Electronics" (ISBN4-906110-43-4))
2002/10	Implementation of solid metal bump interconnection technology for high density interconnection and thermal management (International Microelectronics And Packaging Society (IMAPS) NORDIC 2002 CONFERENCE)